WIRELESS TRANSMITTER AND RECEIVER
WIRELESS TRANSMITTER AND RECEIVER
WIRELESS TRANSMITTER AND RECEIVER
WIRELESS TRANSMITTER AND RECEIVER
WIRELESS TRANSMITTER AND RECEIVER
WIRELESS TRANSMITTER AND RECEIVER

WIRELESS TRANSMITTER AND RECEIVER

Price 8100.0 INR/ Number

MOQ : 1 Number

WIRELESS TRANSMITTER AND RECEIVER Specification

  • Surface Finish
  • Polishing
  • Product Type
  • WIRELESS TRANSMITTER AND RECEIVER
  • Application
  • Industrial
  • Frequency (MHz)
  • 50 Hertz (HZ)
  • Rated Voltage
  • 220 Volt (V)
  • Color
  • Black
  • Usage & Applications
  • Transmitter Receiver
  • Warranty
  • 1 Year
  • Size
  • Standard
  • Material
  • Metal
 

WIRELESS TRANSMITTER AND RECEIVER Trade Information

  • Minimum Order Quantity
  • 1 Number
  • Supply Ability
  • 100 Per Week
  • Delivery Time
  • 7 Days
 

About WIRELESS TRANSMITTER AND RECEIVER

  • Low R_DS(on):

    • R_DS(on) stands for "Drain-Source On-Resistance". The IRFLZDD03 has a low R_DS(on) value, which means it offers low resistance between the drain and source terminals when it is turned on. This results in lower power losses and higher efficiency in switching applications.
  • Low Gate Charge:

    • The MOSFET has a low gate charge, which means it requires less energy to switch the gate on and off. This is beneficial for applications requiring fast switching speeds and low power consumption.
  • High-Speed Switching:

    • Designed for high-speed switching applications, which makes it suitable for use in high-frequency circuits.
    • High-Performance Power Management:

      • The IRPLACD05 is designed to manage power efficiently in various electronic applications. It integrates multiple functions to optimize power performance and improve overall system efficiency.
    • Integrated Protection Features:

      • Includes built-in protection features such as overcurrent protection, overtemperature protection, and short-circuit protection to ensure reliable operation and safeguard the circuit against potential faults.
    • Compact Package:

      • The IC is housed in a compact package, which is advantageous for space-constrained applications and helps in simplifying the design and layout of the PCB.
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